Methos for fabricating an organic electro-luminescence device

ABSTRACT

A method for fabricating an organic electro-luminescence device, comprising: forming a first conductive layer comprising a first electrode and a contact pattern on a substrate; foil ling a first mask on the first conductive layer, the first mask comprising an opening for exposing a portion of the first electrode and a portion of the contact pattern; forming a patterned organic functional layer by shielding of a second mask, the patterned organic functional layer covering the first mask and the first electrode exposed by the first mask, and the second mask being disposed over the first mask to shield the portion of the contact pattern exposed by the opening; forming a second conductive layer and patterning the second conductive layer by removing the first mask and a portion of the second conductive layer on the first mask to form a second electrode electrically connected to the contact pattern.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefits of U.S. provisionalapplication Ser. No. 62/140,474, filed on Mar. 31, 2015. The entirety ofthe above-mentioned patent application is hereby incorporated byreference herein and made a part of this specification.

BACKGROUND

1. Technical Field

The present disclosure generally relates to a roll-to-roll process, inparticular, to a method for fabricating an organic electro-luminescencedevice.

2. Description of Related Art

Organic electro-luminescent devices having high quantum efficiency andlow power consumption are widely utilized in display and illuminationfields. Since organic electro-luminescent devices are advantaged inlight-weight and nice color rendering, organic electro-luminescentdevices are considered as a mainstream of next generation displays andillumination devices. Currently, fabrication cost of organicelectro-luminescent devices cannot be reduced easily, and differentroll-to-roll processes and apparatuses designed for mass production areproposed accordingly. However, the aforesaid roll-to-roll processes forfabricating organic electro-luminescence devices suffers seriousalignment issue (i.e., mis-alignment between stacked layers of thefabricated organic electro-luminescence devices occurs) which causes lowyield rate. Accordingly, solutions for resolving the alignment issueduring the roll-to roll processes are required.

SUMMARY

Accordingly, the present disclosure is directed to a method forfabricating an organic electro-luminescence device.

A method for fabricating an organic electro-luminescence device,comprising: forming a first conductive layer on a substrate, the firstconductive layer comprising a first electrode and a contact patternelectrically insulated from the first electrode; forming a first mask onthe first conductive layer, the first mask comprising an opening forexposing a portion of the first electrode and a portion of the contactpattern; forming a patterned organic functional layer by shielding of asecond mask, the patterned organic functional layer covering the firstmask and the first electrode exposed by the first mask, and the secondmask being disposed over the first mask to shield the portion of thecontact pattern exposed by the opening; removing the second mask afterforming the patterned organic functional layer; forming a secondconductive layer over the patterned organic functional layer, the firstmask and the contact pattern exposed by the opening; and patterning thesecond conductive layer by removing the first mask and a portion of thesecond conductive layer on the first mask to form a second electrodeelectrically connected to the contact pattern.

A method for fabricating an organic electro-luminescence device,comprising: forming a first conductive layer on a substrate, the firstconductive layer comprising a first electrode and a contact patternelectrically insulated from the first electrode; forming a first maskover the first conductive layer, the first mask comprising a firstopening for exposing a portion of the first electrode and a portion ofthe contact pattern; forming a second mask on the first mask, the secondmask comprising a second opening, the second mask shielding the contactpattern exposed by the first opening and the second opening exposing aportion of the first electrode; forming a patterned organic functionallayer on the first electrode by shielding of the second mask; removingthe second mask after forming the patterned organic functional layer;forming a second conductive layer over the patterned organic functionallayer, the first mask and the contact pattern; and patterning the secondconductive layer by removing the first mask and a portion of the secondconductive layer on the first mask to form a second electrodeelectrically connected to the contact pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure, and are incorporated in and constitutea part of this specification. The drawings illustrate embodiments of thedisclosure and, together with the description, serve to explain theprinciples of the disclosure.

FIG. 1A through FIG. 1F schematically illustrate a method forfabricating an organic electro-luminescence device in accordance with afirst embodiment.

FIG. 2A through FIG. 2F are top views or bottom views of the method forfabricating an organic electro-luminescence device in accordance withthe first embodiment.

FIG. 3A through FIG. 3F are cross-sectional views along thecross-section IT in FIG. 2A through FIG. 2F.

FIG. 4A through FIG. 4I schematically illustrate a method forfabricating an organic electro-luminescence device in accordance with asecond embodiment.

FIG. 5A through FIG. 5I are top views or bottom views of the method forfabricating an organic electro-luminescence device in accordance withthe second embodiment.

FIG. 6A through FIG. 6I are cross-sectional views along thecross-section I-I′ in FIG. 5A through FIG. 5I.

DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to the present preferredembodiments of the disclosure, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numbers areused in the drawings and the description to refer to the same or likeparts.

First Embodiment

FIG. 1A through FIG. 1F schematically illustrate a method forfabricating an organic electro-luminescence device in accordance with afirst embodiment. FIG. 2A through FIG. 2F are top views or bottom viewsof the method for fabricating an organic electro-luminescence device inaccordance with the first embodiment. FIG. 3A through FIG. 3F arecross-sectional views along the cross-section IT in FIG. 2A through FIG.2F.

Referring to FIG. 1A, FIG. 2A and FIG. 3A, a roll-to-roll apparatusincluding a plurality of rollers R are provided. The rollers R arecapable of conveying a substrate 100 along a transmission direction D1.In this embodiment, the substrate 100 is provided with a firstconductive layer 110 formed thereon. The substrate 100 is an ultra-thin(e.g., less than 100 micro-meter) and flexible glass substrate. However,the material of the substrate 100 is not limited thereto. The firstconductive layer 110 comprises a first electrode 112 and at least onecontact pattern 114 electrically insulated from the first electrode 112.As shown in FIG. 2A and FIG. 3A, in this embodiment, two contactpatterns 114 are formed at two opposite sides of the first electrode112. It is noted that the shape and the number of the contact patterns114 are not limited in this embodiment.

For instance, a method for fabricating the first electrode 112 and thecontact patterns 114 may comprises the following steps. First, atransparent conductive oxide (TCO) layer is formed over the substrate100 through sputtering, for example. Then, the TCO layer is patternedthrough laser irradiation provided by a laser light source L, forexample. After the TCO layer is patterned, the first electrode 112 maycomprise two notches and the contact patterns 114 are located in thenotches. As shown in FIG. 2A and FIG. 3A, after the TCO layer ispatterned, a gap G exists between the first electrode 112 and eachcontact pattern 114 such that the contact patterns 114 are capable ofbeing electrically insulated from the first electrode 112.

Referring to FIG. 1B, FIG. 2B and FIG. 3B, after the first electrode 112and the contact patterns 114 are formed over the substrate 100, a firstmask 120 is formed on the first conductive layer 110. The first mask 120comprises an opening 122 for exposing a portion of the first electrode112 and a portion of the contact patterns 114. The gap G between thefirst electrode 112 and each contact pattern 114 is partially exposed bythe opening 122 of the first mask 120. As shown in FIG. 2B and FIG. 3B,a portion of the gap G between the first electrode 112 and each contactpattern 114 is filled and covered by the first mask 120. Furthermore, aperipheral area of the first electrode 112 and a portion of each contactpattern 114 are covered by the first mask 120. In other words, a centralarea of the first electrode 112 is exposed by the opening 122 of thefirst mask 120.

Referring to FIG. 1C, FIG. 2C and FIG. 3C, a second mask 130 is providedover the first mask 120 so as to shield the portion of each contactpattern 114 exposed by the opening 122 of the first mask 120. In otherwords, the contact patterns 114 and the gaps G are covered and shieldedby the second mask 130. Beside, portions of the first mask 120 areuncovered and exposed by the second mask 130. As shown in FIG. 2B, thefirst mask 120 is a frame mask having the opening 122, the second mask130 comprises at least one pair of shielding strips 132, and alengthwise direction of the shielding strips 132 is parallel to thetransmission direction D1. In this embodiment, the second mask 130 isprovided over and in contact with the first mask 120, and the secondmask 130 is not in contact with the first conductive layer 110, forexample.

After the second mask 130 is provided, an evaporation process is, forexample, performed to form a patterned organic functional layer 140 byshielding of a second mask 130. The patterned organic functional layer140 covers the portions of the first mask 120 that are exposed by thesecond mask 130 and the central area of the first electrode 112 that isexposed by the opening 122 of the first mask 120.

As shown in FIG. 2C, since the second mask 130 is not in contact withthe first conductive layer 110, the evaporated patterned organicfunctional layer 140 may cover sidewalls of the first electrode 112 thatare exposed by the opening 122 of the first mask 120. In other words,the patterned organic functional layer 140 may extend into the gaps G soas to encapsulate sidewalls and a top surface of the first electrode 112that are exposed by the opening 122 of the first mask 120.

Referring to FIG. 1D, FIG. 2D and FIG. 3D, after forming the patternedorganic functional layer 140, the substrate 100 comprising the firstconductive layer 110, the first mask 120 and the patterned organicfunctional layer 140 formed thereon is conveyed along the transmissiondirection D1 to ensure that the second mask 130 is removed. Then, asecond conductive layer 150 is formed over the patterned organicfunctional layer 140, the first mask 120 and the contact pattern 114exposed by the opening 122 of the first mask 120. In this embodiment,the second conductive layer 150 is formed by evaporation process.

As shown in FIG. 3D, first electrode 112 and the second conductive layer150 are spaced apart by the patterned organic functional layer 140,since the patterned organic functional layer 140 extends into the gaps Gso as to encapsulate sidewalls and a top surface of the first electrode112 that are exposed by the opening 122 of the first mask 120. In otherwords, the patterned organic functional layer 140 may prevents shortcircuit between the first electrode 112 and the second conductive layer150.

Referring to FIG. 1E, FIG. 2E and FIG. 3E, after the second conductivelayer 150 is formed, the second conductive layer 150 is patterned byremoving the first mask 120 and a portion of the second conductive layer150 on the first mask 120 so as to form a second electrode 152. Thesecond electrode 152 is electrically connected to the contact patterns114 and is spaced apart from the first electrode 112 by the patternedorganic functional layer 140. After the second electrode 152 is formed,fabrication of the organic electro-luminescence device of thisembodiment is about accomplished.

Referring to FIG. 1F, FIG. 2F and FIG. 3F, in order to enhancereliability of the organic electro-luminescence device, an encapsulation160 may be formed to encapsulate the second electrode 152. In someembodiments, the encapsulation 160 may further encapsulate a portion ofthe contact patterns 114.

It is noted that deviation of the substrate 100 along a direction D2perpendicular to the transmission direction D1 often occurs when thesubstrate 100 is conveyed along the transmission direction D1. Suchdeviation of the substrate 100 may cause mis-alignment between stackedlayers of the organic electro-luminescence devices. Since first mask 120is formed over the substrate 100, the first mask 120 can minimize theabove-mentioned mis-alignment issue in the directions D1 and D2.

Second Embodiment

FIG. 4A through FIG. 4I schematically illustrate a method forfabricating an organic electro-luminescence device in accordance with asecond embodiment. FIG. 5A through FIG. 5I are top views or bottom viewsof the method for fabricating an organic electro-luminescence device inaccordance with the second embodiment. FIG. 6A through FIG. 6I arecross-sectional views along the cross-section I-I′ in FIG. 5A throughFIG. 5I.

Referring to FIG. 4A, FIG. 5A and FIG. 6A, a roll-to-roll apparatusincluding a plurality of rollers R are provided. The rollers R arecapable of conveying a substrate 200 along a transmission direction D1.In this embodiment, the substrate 200 is provided with a firstconductive layer 210 formed thereon. The substrate 200 is an ultra-thin(e.g., less than 100 micro-meter) and flexible glass substrate. However,the material of the substrate 200 is not limited thereto. The firstconductive layer 210 comprises a first electrode 212 and at least onecontact pattern 214 electrically insulated from the first electrode 212.As shown in FIG. 5A and FIG. 6A, in this embodiment, two contactpatterns 214 are formed at two opposite sides of the first electrode212. It is noted that the shape and the number of the contact patterns214 are not limited in this embodiment.

For instance, a method for fabricating the first electrode 212 and thecontact patterns 214 may comprises the following steps. First, atransparent conductive oxide (TCO) layer is formed over the substrate200 through sputtering, for example. Then, the TCO layer is patternedthrough laser irradiation provided by a laser light source L, forexample. After the TCO layer is patterned, the first electrode 212 maycomprise two notches and the contact patterns 214 are located in thenotches. As shown in FIG. 2A and FIG. 3A, after the TCO layer ispatterned, a gap G exists between the first electrode 212 and eachcontact pattern 214 such that the contact patterns 214 are capable ofbeing electrically insulated from the first electrode 212.

Referring to FIG. 4B, FIG. 5B and FIG. 6B, after the first electrode 212and the contact patterns 214 are formed over the substrate 200, a mask220 for defining sequentially formed encapsulation (i.e., a third mask220) is formed on the first conductive layer 210. The third mask 220comprises a third opening 222 for exposing a portion of the firstelectrode 212 and a portion of the contact patterns 214. The gap Gbetween the first electrode 212 and each contact pattern 214 ispartially exposed by the third opening 222 of the third mask 220. Asshown in FIG. 5B and FIG. 6B, a portion of the gap G between the firstelectrode 212 and each contact pattern 214 is filled and covered by thethird mask 220. Furthermore, a peripheral area of the first electrode212 and a portion of each contact pattern 214 are covered by the thirdmask 220. In other words, a central area of the first electrode 212 isexposed by the third opening 222 of the third mask 220. It is noted thatformation of the third mask 220 is optional in this embodiment.

Referring to FIG. 4C, FIG. 5C and FIG. 6C, a first mask 230 is thenformed over the first conductive layer 210. In this embodiment, thefirst mask 230 is formed on the third mask 220. The first mask 230comprises a first opening 232 for exposing a portion of the firstelectrode 212 and a portion of the contact patterns 214, wherein thefirst opening 232 of the first mask 230 is smaller than the thirdopening 222 of the third mask 220. The gap G between the first electrode212 and each contact pattern 214 is partially exposed by the thirdopening 222 of the third mask 220.

It should be noted that formation of the third mask 220 is optional inthis embodiment. When the formation of the third mask 220 is omitted(i.e., the first mask 230 is formed on and in contact with the firstconductive layer 210), a portion of the gap G between the firstelectrode 212 and each contact pattern 214 is filled and covered by thefirst mask 230. Furthermore, a peripheral area of the first electrode212 and a portion of each contact pattern 214 are covered by the firstmask 230. In other words, a central area of the first electrode 212 isexposed by the first opening 232 of the first mask 230.

Referring to FIG. 4D, FIG. 5D and FIG. 6D, a second mask 240 is formedon the first mask 230, wherein the second mask 240 comprises a secondopening 242, the second mask 240 shields the contact patterns 214exposed by the first opening 232 of the first mask 230, and a portion ofthe first electrode 212 is exposed by the second opening 242. As shownin FIG. 5D and FIG. 6D, the second opening 242 of the second mask 240 issmaller than the first opening 232 of the first mask 230. In thisembodiment, the first mask 230, the second mask 240 and the third mask220 are frame masks having openings in different sizes. In thisembodiment, the second mask 240 is provided over and in contact with thefirst mask 230, and the second mask 240 is not in contact with the firstconductive layer 210, for example.

Referring to FIG. 4E, FIG. 5E and FIG. 6E, after the second mask 240 isprovided, an evaporation process is, for example, performed to form apatterned organic functional layer 250 by shielding of the second mask240. The evaporated patterned organic functional layer 250 covers thecentral area of the first electrode 212 that is exposed by the secondopening 242 of the second mask 240 and the first opening 232 of thefirst mask 230.

As shown in FIG. 5E, since the second mask 240 is not in contact withthe first conductive layer 210, the evaporated patterned organicfunctional layer 250 may cover sidewalls of the first electrode 212 thatare exposed by the first opening 232, the second opening 242 and thethird opening 222. In other words, the patterned organic functionallayer 250 may extend into the gaps G so as to encapsulate sidewalls anda top surface of the first electrode 212.

Referring to FIG. 4F, FIG. 5F and FIG. 6F, after forming the patternedorganic functional layer 250, the second mask 240 is removed. In orderto remove the second mask 240, the adhesion between the first mask 230and the second mask 240 is required to be smaller than the adhesionbetween the first mask 230 and the third mask 220. Then, a secondconductive layer 260 is formed over the patterned organic functionallayer 250, the first mask 230 and a portion of the contact pattern 214.In this embodiment, the second conductive layer 260 is formed byevaporation process, for example.

As shown in FIG. 6F, since the patterned organic functional layer 250extends into the gaps G so as to encapsulate sidewalls and a top surfaceof the first electrode 212 which are exposed by the opening 232 of thefirst mask 230, the first electrode 212 and the second conductive layer260 are spaced apart by the patterned organic functional layer 250. Inother words, the patterned organic functional layer 250 may preventsshort circuit between the first electrode 212 and the second conductivelayer 260.

Referring to FIG. 4G, FIG. 5G and FIG. 6G, after forming the secondconductive layer 260, the second conductive layer 260 is patterned byremoving the first mask 230 and a portion of the second conductive layer260 on the first mask 230 so as to form a second electrode 262. In orderto remove the first mask 230, the adhesion between the first mask 230and the third mask 220 is required to be smaller than the adhesionbetween the third mask 220 and the first conductive layer 212. Thesecond electrode 262 is electrically connected to the contact patterns214 and is spaced apart from the first electrode 212 by the patternedorganic functional layer 250. After the second electrode 262 is formed,fabrication of the organic electro-luminescence device of thisembodiment is about accomplished.

Referring to FIGS. 4H-4I, FIGS. 5H-5I and FIGS. 6H-6I, in order toenhance reliability of the organic electro-luminescence device, anencapsulation material layer 270 may be formed to cover the third mask220, a portion area of the contact patterns 214 and the second electrode262. Then, the encapsulation material layer 270 is patterned by removingthe third mask 220 and a portion of the encapsulation material layer 270on the third mask 220 so as to form an encapsulation 272.

In the aforesaid embodiments, it is noted that deviation of thesubstrate (100, 200) along a direction D2 perpendicular to thetransmission direction D1 often occurs when the substrate (100, 200) isconveyed along the transmission direction D1. Such deviation of thesubstrate (100, 200) may cause mis-alignment between stacked layers ofthe organic electro-luminescence devices. Since the first mask (120,230), the second mask (130, 240) and the third mask 220 are formed overthe substrate (100, 200), the aforesaid first mask 230, the second mask(130, 240) and the third mask 220 can minimize the above-mentionedmis-alignment issue in the directions D1 and D2.

In this disclosure, the mask formed on the substrate can effectivelyresolve alignment issue of stacked layers in the organicelectro-luminescence devices, and thus enhance yield rate of massproduction of the organic electro-luminescence devices.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentdisclosure without departing from the scope or spirit of the disclosure.In view of the foregoing, it is intended that the present disclosurecover modifications and variations of this disclosure provided they fallwithin the scope of the following claims and their equivalents.

What is claimed is:
 1. A method for fabricating an organicelectro-luminescence device, comprising: forming a first conductivelayer on a substrate, the first conductive layer comprising a firstelectrode and a contact pattern electrically insulated from the firstelectrode; forming a first mask on the first conductive layer, the firstmask comprising an opening for exposing a portion of the first electrodeand a portion of the contact pattern; forming a patterned organicfunctional layer by shielding of a second mask, the patterned organicfunctional layer covering the first mask and the first electrode exposedby the first mask, and the second mask being disposed over the firstmask to shield the portion of the contact pattern exposed by theopening; removing the second mask after forming the patterned organicfunctional layer; forming a second conductive layer over the patternedorganic functional layer, the first mask and the contact pattern exposedby the opening; and patterning the second conductive layer by removingthe first mask and a portion of the second conductive layer on the firstmask to form a second electrode electrically connected to the contactpattern.
 2. The method according to claim 1, wherein the first electrodecomprises a notch and the contact pattern is located in the notch. 3.The method according to claim 2, wherein a gap is between the firstelectrode and the contact pattern.
 4. The method according to claim 3,wherein the gap is partially exposed by the opening of the first maskand is shielded by the second mask.
 5. The method according to claim 1,wherein the first electrode and the second electrode are spaced apart bythe patterned organic functional layer.
 6. The method according to claim1, wherein the substrate is conveyed along a transmission direction toform the first electrode, the contact pattern, the first mask, thepatterned organic functional layer and the second electrode on thesubstrate.
 7. The method according to claim 6, wherein the first mask orthe second mask is a frame mask.
 8. The method according to claim 6,wherein the second mask comprises at least one pair of shielding strips,and a lengthwise direction of the shielding strips is parallel to thetransmission direction.
 9. The method according to claim 1 furthercomprising: forming an encapsulation to encapsulate the secondelectrode.
 10. A method for fabricating an organic electro-luminescencedevice, comprising: forming a first conductive layer on a substrate, thefirst conductive layer comprising a first electrode and a contactpattern electrically insulated from the first electrode; forming a firstmask over the first conductive layer, the first mask comprising a firstopening for exposing a portion of the first electrode and a portion ofthe contact pattern; forming a second mask on the first mask, the secondmask comprising a second opening, the second mask shielding the contactpattern exposed by the first opening, and the second opening exposing aportion of the first electrode; forming a patterned organic functionallayer on the first electrode by shielding of the second mask; removingthe second mask after forming the patterned organic functional layer;forming a second conductive layer over the patterned organic functionallayer, the first mask and the contact pattern; and patterning the secondconductive layer by removing the first mask and a portion of the secondconductive layer on the first mask to form a second electrodeelectrically connected to the contact pattern.
 11. The method accordingto claim 10, wherein the first electrode comprises a notch and thecontact pattern is located in the notch.
 12. The method according toclaim 11, wherein a gap is between the first electrode and the contactpattern.
 13. The method according to claim 12, wherein the gap ispartially exposed by the first opening of the first mask.
 14. The methodaccording to claim 10, wherein the first electrode and the secondelectrode are spaced apart by the patterned organic functional layer.15. The method according to claim 10, wherein the substrate is conveyedalong a transmission direction to form the first electrode, the contactpattern, the first mask, the second mask, the patterned organicfunctional layer and the second electrode on the substrate.
 16. Themethod according to claim 15, wherein the first mask or the second maskis a frame mask.
 17. The method according to claim 15, wherein thesecond mask at least one pair of shielding strips, and a lengthwisedirection of the shielding strips is parallel to the transmissiondirection.
 18. The method according to claim 10 further comprising:forming a third mask on the first conductive layer before the first maskis formed, the third mask comprising a third opening for exposing aportion of the first electrode and a portion of the contact pattern;forming an encapsulation material layer over the second electrode andthe third mask; and patterning the encapsulation material layer byremoving the third mask and a portion of the encapsulation materiallayer on the third mask to form an encapsulation.
 19. The methodaccording to claim 18, wherein an adhesion between the first mask andthe second mask is smaller than an adhesion between the first mask andthe third mask.
 20. The method according to claim 18, wherein theadhesion between the first mask and the third mask is smaller than anadhesion between the third mask and the first conductive layer.